Tewkesbury MA (SPX) May 02, 2008 – Raytheon has been awarded a $3.3 million contract to overcome thermal challenges in semiconductors designed for next-generation high-power radars and other electronic systems. The award is for the first of a three-phase Defense Advanced Research Projects Agency (DARPA) Radio Frequency Thermal Ground Plane program that could be worth $8 million if all options are exercised.